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Production Overview
Plastic Small Outline Transistor packaging (SOT-23/SC-59) is a principal package using SMD technology. It is widely used in low cost and manual applications. FSMC offers SC59-3,SC59-3H,SC59-5,SC59-6 packages.
Application
Small Outline Transistor packages are considered one of the most established industry standard packages. SC-59 is commonly used in wireless/RF and analog devices, portable products such as cell phones, data storage systems, notebook computers and pagers.
Features
* JEDEC standard compliant or reference
* Wide choice of pad sizes to meet die size per customer lead frame design capability
* Pb-free process ready and Green Molding Compound
Design Rule
| Wafer Thickness |
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80~280um |
Minimum Sawing
Street Width |
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≥60um |
| Minimum die Size |
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0.20mm*0.20mm |
| Maximum wafer Size |
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D≤200mm |
Package Outline
| SC59 series (All units are in mm) |
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| Number |
PKG TYPE |
Lead count |
Lead Width |
Lead Thickness |
bond pad |
POD |
| 1 |
SC-59-3 |
3 |
0.40 |
0.17 |
DOWN |
DOWN |
| 2 |
SC59-3H-12R |
3 |
0.40 |
0.17 |
DOWN |
DOWN |
| 3 |
SC59-3-12R |
3 |
0.40 |
0.17 |
DOWN |
DOWN |
| 4 |
SC-59-5 |
5 |
0.40 |
0.17 |
DOWN |
DOWN |
| 5 |
SC59-3H-12R |
5 |
0.40 |
0.17 |
DOWN |
DOWN |
| 6 |
SC59-5-12R |
5 |
0.40 |
0.17 |
DOWN |
DOWN |
| 7 |
SC-59-6 |
6 |
0.40 |
0.17 |
DOWN |
DOWN |
| 8 |
SC59-6-12R |
6 |
0.40 |
0.17 |
DOWN |
DOWN |
Packing & Shipping
| Carrier Tape: |
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| Number |
PKG TYPE |
QTY/Reel |
Reel/Inner Box |
Total per inner box |
Boxe/case |
Total per case |
| 1 |
SC-59-3 |
3000 |
5 |
15000 |
10 |
150000 |
| 2 |
SC59-3H-12R |
3000 |
5 |
15000 |
10 |
150000 |
| 3 |
SC59-3-12R |
3000 |
5 |
15000 |
10 |
150000 |
| 4 |
SC-59-5 |
3000 |
5 |
15000 |
10 |
150000 |
| 5 |
SC59-3H-12R |
3000 |
5 |
15000 |
10 |
150000 |
| 6 |
SC59-5-12R |
3000 |
5 |
15000 |
10 |
150000 |
| 7 |
SC-59-6 |
3000 |
5 |
15000 |
10 |
150000 |
| 8 |
SC59-6-12R |
3000 |
5 |
15000 |
10 |
150000 |
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